环氧树脂中空微针阵列的制备方法

Preparation method of epoxy resin hollow micropin array

Abstract

The invention relates to a preparation method of an epoxy resin hollow micropin array, belonging to the technical field of a microelectronic mechanical system. The preparation method adopts the methodof organically combining inclined rotation and the traditional photoetching to prepare an SU-8 three-dimensional microstructure, obtains a bracket inclined angle of 0 to 90 degrees by adjusting the height of the bracket, then places a motor on a horizontal base plate, drives a substrate adhered thereon to rotate freely by the motor, controls rotating speed by externally applying direct current voltage on the motor, fills polydimethylsiloxane into a mold with the SU-8 three-dimensional microstructure, obtains a hollow micropin array mold after demolding, refills polydimethylsiloxane after sputtering metallic chromium-copper on the hollow micropin array for compounding, obtains a hollow micropin array mold after demolding, fills epoxy resin on the mold, demolds after grinding the bottom part into polydimethylsiloxane, and obtains the epoxy resin hollow micropin array. The prepared micropin has smooth taper shape, has better tip end and has little injury to the skin when in work.
一种微型电子机械系统技术领域的环氧树脂中空微针阵列的制备方法,采用倾斜旋转与传统光刻有机结合的方法制备SU-8三维微结构,通过调整支架的高度,获得0-90度的支架倾角,然后在水平基板上放置电机,由电机带动粘附在其上的基片自由旋转,并通过外加在电机上直流电压控制转速,将聚二甲基硅氧烷填充到SU-8三维微结构的模具中,脱模后得到中空微针阵列,在中空微针阵列上溅射金属铬铜复合后再次填充聚二甲基硅氧烷,脱模后得到中空微针阵列模具,在该模具上填充环氧树脂,然后将底部磨至聚二甲基硅氧烷后脱模,即可得到环氧树脂空心微针阵列,制备所得微针的锥形光滑,具有较好的尖端,工作时对皮肤的损伤小。

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Cited By (8)

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