Material removing rate control system based on fast polishing technology

一种基于快速抛光技术的材料去除率控制系统

Abstract

一种基于快速抛光技术的材料去除率控制系统,涉及一种材料去除率控制系统。提供一种基于快速抛光技术的材料去除率控制系统。设有工控机系统、数控系统、伺服系统、数控抛光机床和材料去除率检测系统。工控机系统输出端与数控系统输入端连接,数控系统输出端与伺服系统输入端连接,伺服系统输出端与数控抛光机床的电机连接,电机驱动3个加工轴:工件旋转轴、工件横移轴和抛光盘旋转轴联动,对工件进行加工,数控抛光机床加工后的工件输出并送入材料去除率检测系统进行材料去除率检测。材料去除率检测系统设有空调恒温系统、激光干涉仪和千分尺。工件加工后送入空调恒温系统,利用激光干涉仪和千分尺测量实际加工后工件材料去除率。
The invention discloses a material removing rate control system based on the fast polishing technology, relating to material removing rate control systems. The system is provided with an industrial control computer system, a numerical control system, a servo system, a numerical control polishing machine and a material removing rate detection system, wherein the output end of the industrial controlcomputer system is connected with the input end of the numerical control system; the output end of the numerical control system is connected with the input end of the servo system; the output end ofthe servo system is connected with the motor of the numerical control polishing machine; the motor drives three processing shafts, namely a workpiece rotating shaft, a workpiece traversing shaft and apolishing disk rotating shaft which are linkaged ganged for processing the workpiece; and the workpiece processed by the numerical control polishing machine is outputted and sent to the material removing rate detection system for material removing rate detection. The material removing rate detection system is provided with an air-condition constant temperature system, a laser interferometer and amicrometer; and the processed workpiece is sent to the air-condition constant temperature system for measuring the workpiece material removing rate after practical processing by the laser interferometer and the micrometer.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (1)

    Publication numberPublication dateAssigneeTitle
    CN-102423870-AApril 25, 2012浙江工业大学微量研磨厚度测量装置